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Quick Details

  • D/C: MTK6572 ARM-CORTEX_A7, Dual Cord 1.3GHz
  • Package: Plastic Bag in Carton
  • Model Number: MTK6572
  • Type: Other
  • Brand Name: YiCeBao
  • Place of Origin: Beijing, China (Mainland)
  • Large Storage: 4GB eMMC+1GB mDDR2

Packaging & Delivery

Packaging Details: Plastic Bag in Carton
Delivery Detail: Within 30 days
Product Description

 

Development Board(Module):

 1) B2B Top(Core) Board*1

2) B2B Base Board *1

3) 5’’ QHD Capacitive Screen*1

4) GPS Antenna*1

5) 2.4GHz Antenna*1

6) 3G WCDMA Antenna*1

7) 5 mega-pixel  Rear Camera*1

8) 30 million pixels Front Camera*1

9) 5V, 2A Adaptor*1

10) B Interface USB Wire*1

11) B Interface Serial Port Wire*1

 

 Parts Instruction:

 

This development module is combined by two boards: Base Board+ Core Board. User can use Core Board  independently.

No.

Description

No.

Description

1

3-Color Indicator Light

17

Mic Interface, Up+, Down -

2

Handset interface, Up+,Down-

18

The user can expand other board(s) by himself, for example Serial port, SPI, I2C and some IO interfaces

3

WCDMA/GSM  SIM Card Slot, Supports WCDMA/GSM

19

Serial Port 1(Level 1.8V)

4

GSM  SIM Card Slot, Supports GSM

20

Serial Port 2(Level 1.8V)

5

Touch-screen cable socket

21

5VDC Power Socket

6

MicroSD Card Slot

22

Rear Camera Socket

7

Volume Up Key

23

Micro USB outlet, same with USB outlet on Base Board, supports OTG

8

Volume Down Key

24

On/Off, Sleep/Wake Up Key, same with the Key (No. 9) on Base Board.

9

On/Off, Sleep/Wake Up Key

25

Volume Up Key, same  with Volume Up Key(No. 7) on Base Board

10

USB

26

2.4GHz  Antenna Interface

11

Vibration Motor

27

GPS Antenna Interface

12

LCD cable outlet

28

Volume Down Key, same with Volume Down Key(No. 8)  on Base Board.

13

3pcs of B2B Mother Socket  , used for connect the Top Board

29

Battery Interface, they are VBAT, NTC and GND from top to down.

14

Front Camera Outlet

30

3G Antenna Interface

15

Headphone Jack

31

YYW-M-6572 Core Module

16

Speaker Interface, Up+, Down –

 

 

Core Module:

YYW-M-6572 core module has the minimum design, is compatible with Android OS. Users can use it to make second development. We accept customization for the Base Board according to user's requirements.

YYW-M-6572 uses MTK6572 processor, it is a high-performance and low-cost processor which is launched by MediaTek. Inc, the core is using ARM cortex_a7. MTK6572 has dual cores, 1.3GHz,supports DDR2 memory, is integrated TFT controller and 3D hardware image processing.

The design for PCB is fully accord with electromagnetic compatibility. Professional circuit design, excellent PCB LA-YOUT, high-quality material PCB board, fully automatic batch production,  all these can ensure the Core Module with stability and quality consistency .

 

Core Module Interface(s):

 

Processor

MTK6572, ARM-CORTEX_A7,Dual-Core 1.3GHz

Memory

DDR2 512MB or 1GB RAM, 4GB eMMC

Interface

Integrated 2 Interface supports High Speed Data Transmission

Audio:

Supports AC97/IIS Digital Audio Interface

Network

Supports several Ethernet interface expansion

USB

1*USB2.0 DEVICE,1*USB 1.1 HOST

  

LCD Interface

Supports MIPI and RGB

Touch Screen Interface

Supports 4-Wire resistive screen and capacitive screen

RTC Clock

Integrated Real Time Clock( RTC Clock Voltage 3V)

Power Supply

4.2V+/-5% Power Supply For the whole module

Module PIN

168 PIN

PCB Board Layers

4 Layers, according with industry electromagnetic requirement

 

 Core Module Specs:

Size40mm*30mm, H =2.5mm
Module PIN168PIN
PCB Board8 Layers, according with industry electromagnetic requirement
Power5V DC Power Supply
Working  VoltageDC5V
Working Current80-300mA
RF InterfaceGPS/Wi-Fi/FM/Bluetooth Antenna, RF Antenna
Function  Interface(s)Supports 2 Lines UART Interface
2 Lines SIM Card outlet(3V or 1.8V)

2*MIC Input

1*Headset Input

E 1*Earphone

USB2.0/USB1.0, USB OTG/HOST
Power on/off

LCD: RGB Interface

          MIPI Interface

          MCU Interface

8*8*2 Matrix Keyboard
GPIOSPI, I2C, A/D, PTC
SD Card
 AudioDigital Audio / Audio Transcoding
Audio ControlGain Control
Operation SystemAndroid4.4.2

 

 

 

12 Features:

1.   High Speed Processor:MTK6572  ARM-CORTEX_A7, Dual Cord 1.3GHz

2.   Large Storage: DDR2 512MB or 1GB RAM, 4GB eMMC

3.   Communication:Dual Cards Dual Standby (3G  HSPA( Down 15Mbps, Up 6Mbps), GPRS/GPS)

4.   Multi Wireless Connection(Wi-Fi, BT, 4.0 BLE)

5.   Android 4.4

6.   Supports Multi  Sensors( GPS, Magnetic sensors, Gravity sensors, Light sensors)

7.   Multi Expand  Interface(s): UART(2),USB2.0 OTG, SDIO, IIC SPI, MIPI

8.   Supports Several Screen Size: 5 Inch HD, 5 Inch QHD, 3.2 Inch QVGA, 2.8 Inch QVGA, 2 Inch QVGA, 1.5 Inch QVGA

9.   Supports  both Capacitive and Resistive Touch Screen

10. Dual Cameras ( Rear AF 5 Mega Pixels and Front FF 2 Mega Pixels)

11. The smallest module in industry (Module size: 30mm*40mm)

 

12. Main Board is according to industry design requirement ( 8 layers PCB, EMC( Electromagnetic Compatibility) design,                      Temperature -20 to +40

 

 

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